Metallux sensors, resistors and industrial joysticks can be found in numerous applications worldwide
Efficient thermal management is a required for nearly all electronic applications. As the size of electronics shrinks while power density increases
MML™ is an advanced new technology that provides the highest capacitance per volume in film capacitors compering to all other existing film solutions.
The MML™ capacitors allow very low-profile configurations and offer high flexibility in the design.
The technology offers a tremendous reduction in size and weight compared to traditional Polypropylene or Polyester dielectrics, due to the unparalleled energy density of 400 J/dm3, together with an increased operating temperature up to 140 °C and transient voltage protection.
Compering the MML technology with MLCC demonstrates between 70% to 90% reduction in weight, while showing no capacitance derating with voltage applied and a low drift < 5% through the temperature range.
case studies have been conducted on actual cases of controls and DC-Links functions for aircraft applications. All have shown about 50% reduction in size and weight compared to other film technologies.
A single MML™ unit can replace a stacked MLCC’s used in different applications. with all the increased reliability that film dielectric offers.
With such outstanding properties, Exxelia new MML™ capacitors are perfectly suitable for power supplies, DC-links, AC/DC/AC power converters, charge/discharge or power generation functions of commercial/military aircraft, satellite platforms and payloads, launchers, defibrillators, downhole tools, and any applications of confined electronics.
Features & Benefits:
Metallux sensors, resistors and industrial joysticks can be found in numerous applications worldwide
Efficient thermal management is a required for nearly all electronic applications. As the size of electronics shrinks while power density increases
Converters/inverters are core systems in industrial power electronics. Their continued development is driven by reduction of installation space
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