Updates

February 22, 2022

Ultra High Thermal Conductivity Applications

Efficient thermal management is a required for nearly all electronic applications. As the size of electronics shrinks while power density increases, common materials often generate hot spots because of insufficient cooling, leading to a low performance. DiaCool™, a metal-diamond composite material, delivers a device-friendly coefficient of thermal expansion (CTE) and very high thermal conductivity.

Ultra-high performance thermal spreaders made with DiaCool™ can be adapted to any design. It exhibits excellent surface quality for die attach and soldering needs. Because the product can be easily adaptable to customer-specific designs, it’s a cost-effective solution for increasing the long-term reliability of power, RF, and laser diodes, and for any applications where thermal management is vital to longevity.

DiaCool™ is currently available in a copper diamond or silver diamond matrix. The DiaCool™ can be plated with a variety of materials to meet your specific requirements. The material is manufactured in a sandwich-like structure, with the composite material located between layers of pure copper or silver. DiaCool™ can be used for die tabs, heat sinks and heat spreaders, and it gives a significant advantage over more conventional laminate or MMC materials.

APPLICATIONS: Power Packages, Opto Packaging, Microwave, MMW Packaging, Diode Sub Mounts, RF

SILVER DIAMOND
580W/m-K
6-7 ppm
220; strength: 220 ±10 MPa
Available in 0.89 mm (.035”) and 1 mm (.040”) thicknesses
AuSn, SOT305, AuSi, AuGe, etc.
Standard plating chemistries or thin-film processing
Laser machining

COPPER DIAMOND
475W/m-K
6-8 ppm
220; strength: 220 ±10 MPa
Available in .89, 1, 2, and 3mm thickness
AuSn, SOT305, AuSi, AuGe, etc.
Standard plating chemistries or thin-film processing
Wire EDM, laser, water jet machining

TECHNICAL FEATURES
MINIMUM THERMAL CONDUCTIVITY
CTE
FLEXURAL STRENGTH
STOCK MATERIALS
SOLDER PREFORMS (shipped separately or preattached)
PROCESSES
MACHINING