PCB / Flex Interconnect Assemblies
Product Families
- 3-D Modeling and Rapid Prototyping
- Connectorized Flex Circuit Assemblies
- Rigid Board Assemblies
- Rigid Flex Circuit Assemblies
Typical Features
- Solidworks 3-D Prototyping
- Fully back-potted and sealed
- Save size, weight, and improve density compared to wire bundles
- Optimized reliability: high-speed, high temp, high shock and vibe
- Superior performance in high shock and vibe applications
- IPC-6012/6013 Specializing in Class III, Types 1–4
- Design, Prototyping, and Production
Solution
Applications
Aviation
Defense
Medical
Space
Manufacturer
